Friday 21 August, 2026
The TMC-E9 eSIM chip series from TMC TONGXIN MICRO has successfully obtained GSMA eUICC Security Assurance (eSA) certification, setting a new industry benchmark for certification speed. This milestone demonstrates the product’s full compliance with stringent international security standards across core aspects such as hardware architecture, operating system, and encryption mechanisms. It enables the delivery of globally applicable, high-security eSIM solutions to end customers, accelerating the large-scale adoption of eSIM technology in smart devices and IoT markets worldwide.
The GSMA eSA certification is a globally recognized eSIM security evaluation framework. Its testing process references the widely accepted Common Criteria (CC) requirements, representing an extremely high-security benchmark. Regarded as a “trust credential” within the industry, it permits eSIM products to connect to operator networks globally.
Fastest in the Industry: Certification Completed in Just 7 Months.
TMC Tongxin Micro’s Security and Identification Product Line Director, Sun Hengbo, stated: “The eSA certification period is long and stringent, typically taking 8 to 16 months in the industry and involving multiple rounds of rigorous testing, documentation review, and security assessments. We completed the process—from application to certification—in just seven months, setting the fastest certification record for a domestic Chinese company to date. This success is driven by the chip’s inherent advantages in security architecture and encryption algorithms, as well as our company’s years of accumulated industrial experience and systematic certification capabilities in the eSIM field.”
As the world’s first Chinese-developed eSIM chip for mobile devices to achieve commercial deployment overseas, the TMC-E9 series has previously obtained multiple international and domestic authoritative certifications, including CC EAL6+, National Security Level 2, UnionPay chip security certification, and AEC-Q100. It has established multi-dimensional competitive advantages in core technologies:
High Hardware Security: With a memory capacity of 512KB to 2MB, the chip incorporates a hardware-level security protection system that meets top-tier international standards.
High System Compatibility: Fully compliant with GSMA SGP.22 V2.5 international standards and domestic communication standards, it supports over 400 global operators, allows for up to 10 Profile downloads, offers eID customization and COS online updates, and enables flexible lifecycle management.
Secure and self-owned Production: As the first GSMA SAS-UP-certified wafer-level personalized security chip company in China, it supports both wafer-level and post-packaging personalization, ensuring end-to-end security control from wafer manufacturing to packaging and testing.
Efficient Terminal Adaptation: The chip provides an LPA (Local Profile Assistant) based on mainstream operating systems like Android, Linux, and RTOS, significantly simplifying the integration process for terminal manufacturers and accelerating customers’ time-to-market.
Currently, the TMC-E9 series has been widely adopted in mobile phones, wearable devices, automotive electronics, and IoT terminals, and has been integrated into the supply chains of several leading domestic and international equipment manufacturers. This eSA certification further bolsters the product’s security credibility in the global market, providing critical support for its expansion into broader application scenarios.
